| PART |
Description |
Maker |
| Q67040-A4463 SGW30N60 Q67040-S4237 Q67041-A4713 SG |
IGBTs & DuoPacks - 30A 600V TO247AC IGBT
IGBTs & DuoPacks - 30A 600V TO263AB SMD IGBT
Fast S-IGBT in NPT-Technology
Fast IGBT in NPT-technology
Heat Sink; Package/Case:TO-220; Thermal Resistance:16.7 C/W; Mounting Type:Through Hole; Length:29.97mm; Height:12.7mm; Width:25.4mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
Heat Sink; Package/Case:TO-220; Thermal Resistance:16.7 C/W; Mounting Type:Through Hole; Length:29.97mm; Height:12.7mm; Width:25.4mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:No RoHS Compliant: No
|
INFINEON[Infineon Technologies AG]
|
| SM6J45A SM6G45 SM6G45A SM6J45 |
BI .DIRECTIONAL TRIODE THYRISTOR SILICON PLANAR TYPE AC POWER CONTROL APPLICATIONS
TOSHIBA BI-DIRECTIONAL TRIODE THYRISTOR SILICON PLANAR TYPE
TO-220 .75H .57W .5D W/MTG TAB
Heat Sink; Package/Case:TO-220; Body Material:Aluminum; Thermal Resistance:27.3 C/W; Color:Black; Leaded Process Compatible:No; Mounting Type:Through Hole; Peak Reflow Compatible (260 C):No; Size/Dimensions:0.750H x 0.500W"
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
Toshiba, Corp.
|
| 37717-1001 37717-0001 |
CoolFin Heat Sink with Integrated Heat Pipes
|
Molex Electronics Ltd.
|
| ATS-19G-03-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-117-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
| MG1018-16 MG1023-16 MG1008-15 MG1006-11 MG1022-16 |
GUNN Diodes Cathode Heat Sink
|
Microsemi Corporation
http://
|
| SQ50X34 |
Heat Sink for DPSS Laser Modules
|
Roithner LaserTechnik G...
|
| LPD45-25B LPD45-30B LPD45-10B LPD45-9B LPD45-6B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| LPD100-25B LPD100-40B LPD100-15B LPD100-20B LPD100 |
Low Pressure Drop Heat Sink
|
ALPHA
|
